基本信息
| 材料 | Alumina的陶瓷 |
|---|---|
| 类型 | 陶瓷盘子 |
| 适用 | 工业陶瓷 |
| 出生地 | Jiangsu China (Mainland) |
| 模式的数量 | HB |
| 牌子的名字 | HB |
aluminaCeramicsubstrate, alumina wafer, alumina substrate The high precision laser cutting processing installations can used for scribing,cutting and drilling ceramic substrates (Minimum hole diameter:0.2mm).Laser cutting method allows to produce ceramic substrates with various outside contour geometries,hole patterns,cut-outs and snap-lines. Benefits: ·High cutting accuracy, very small tolerance. ·Eliminating the time-consuming and costly tool fabrication stage. ·As well as increasing the goods supply efficiency by a big margin and shortening the processing circle. size: produce as your requirement
交货条款及包装
Packaging Detail: wooden box Delivery Detail: 30 days
端口: shanghai/qingdao
付款条款
Letter of credit
Telegraphic transfer
MoneyGram
Western Union
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支付方式
我们接受：
