基本信息
| 牌子的名字 | DEEPCOOL |
|---|---|
| 模式的数量 | S71UP003 |
| 出生地 | Guangdong China (Mainland) |
| 类型 | Heatsink |
| Heatsink材料 | 铝 |
Sever heatsink-S71UP003 Application for: Intel LGA 775 1U Server Technical Parameter: Heatsink Dimension:90×90×25mmHeatsink Material:CopperNo. of Fins:57+/- 1 pcsClips:Screw &SpringClipBack Plate:Material: SPCC, Painted BlackWeight:690gNoise0 dB(A)TIM:SC102 (1g)Main Process:Skiving Super thin fins with the best thermal conductivity areas No solder paste between the skived fins and the base plate Material: copper C1100 surface treatment: antioxidation
交货条款及包装
Packaging Detail: Retail packaging: neutral packagingTransport packaging: carton Delivery Detail: within 3 days after receipt of payment
端口: Shenzhen
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