PCBA with BGA SMT, 6Layers PCB

BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO14000, ROHS Compliant., a series of testing. We have a team they have themselves professional experience over 20 years on actual productions and designing. Our system from materials and manufacturing to delivery will make you to consummate a business transaction. As a matter of fact, everything has developed as our customers wanted. One-station turnkey electronic manufacturing service to international customers. PCB Key Specifications Leyer 2-16, Blind and Buried via, Rigid and Flex PCB, High TG and High frequency material. Board thickness 0.6mm - 3mm , Maximum panel size 550 X 660mm Minimum Hole diameter 0.35mm, Minimum Line width and space 0.1mm, Surface required Plated gold, immersion gold, Free lead HASL Twist and Warp less than 1% PCB Assembly key specifications: Placement precision: 0.1mm on integraded circuit parts with SO, SOP, SOJ,TSSOP,QFP,BGA, and so on. SMT for 0201,0402,0603,0805,1008,1206,1210, and so on. DIP pitches Throu hole down to 0.60mm, solder components to the underside of board without disrupting the topside Inspection in line for QOI AND ICT testing in line. X-ray inspection for BGA.