Mould design for Carrier

3D modeling Cover Cap Our design experience and ability levels 1.We can use 2d drawings, 3D modeling 2.Connectors, semiconductor IC shells design 3.IT products and computer peripherals mold 4.Electrical and mechanical products design 5.materials:plastic and aluminum *We can do the toy mold, complicated mould The development and design scope 1.Using 2d drawings of 3d modeling 2.Plastic mold design