lead free tin alloy solder bar

Lead-free solder bar Lead-free solder barLead-free solder copper bar(Sn-Cu0.7)CategoryAlloy componentFLUXMelting pointProportionstretchSC70XSn/Cu0.7F32277.448Length:320mmManner of packing:25KG/caseLead-free solder bar(Sn- Ag-Cu)CategoryAlloy componentFLUXMelting pointProportionStretchSAC0307XSn/Ag0.3/Cu0.7/XF3217-2207.452SAC305XSn/Ag3.0/Cu0.5/XF3217-2207.452Length:320mmManner of packing:25KG/caseLead-free solder bar character:√Reduce the flux dispersal√Reduce the residue√The end of the corresponding pin can be used for treatment (approximately to 480 °C)√Reduce smoke and odor gases√Inhibition of cracking,Corrosion of copper and alloy layer growthHigh economic√Solder bar can be divided into no-clean solder bar (TELECORE), water-soluble(PURECORE). Specifically for hand soldering, component installation and tablesSurface mount technology repair welding. All the production base by international standardsOrganization 12224-1 specifications and test methods.√Apply to all manual and automatic welding machines, parts installation and repair.√High welding capacity, low or no flux residue corrosion√Unit flux distribution√Good solderability, solder joint strength√With rosin / resin and lead-free options.