Immersion silver printed circuit board with sophis

Immersion silver printed circuit board with sophisticated Our PCB capability: Material used: FR4. High Minimum 170, Hifrequency, Metal based: Alumininium ect. Maximum Panel size:39*23 (1000mm*600mm) Line Width & Spacing: Minimum Line width( Internal)4mil(0.1mm) for mass production and 3mil for samples Minimum Line Width(External):4mil(0.1mm) for mass production and 3mils for samples. Minimum Line Spacing (External):4mil(0.1mm) for mass production and 3mils for samples. Layer Count & Thickness:1-16layers Minimum Thickness(2layers):4mil(0.1mm) Minimum Thickness(4layers):12ml(0.3mm) Minimum Thickness(6Layers):16mil(0.4mm) Minimum Thickness(8Lyesrs):24mil(0.6mm) Maximum Thickness(10layers):200mil(5.0mm) Lyaer to Layer Registration:+/-5mil(0.13mm) Via/Drill Size:Minimum Drill Hole Diameter 8mil(0.25mm) Minimum Via Size:8mil(0.2mm) Hole to Hole Tolerance:+/-3mil(0.08mm) Micro Via:4mil(0.1mm) Solder Mask Bridge between Solder Dam 3mil(0.07mm) Warpage:0.5% Impedance:+/-10% Surface treatment: Hard gold/ ENIG /HASL / Carbon Ink/OSP(ENTEK CU 106AX)/ Immersion Tin