immersion gold printed circuit board

Material: FR4, High TG FR4,Halogen Free material,CEM-3, Rogers HF material, etc. Layer counts: 2-28 layers Finished Copper Thickness: 0.5-5 OZ Finished Board Thickness: 0.2-6.0mm Min. Line/Track Width: 4mil Min. Line/Track Space: 4mil Min. Contour Tolerance: +/-0.1mm Min. Finished Diameter of PTH Hole: 0.1mm Max. Board Thickness/Hole Ratio: 12:1 Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil) Min. Legend(Silkscreen) Track Width: 5mil Min. Legend(Silkscreen) Height: 30mil Min. drilling slot size: 0.6mm Solder mask color: green, black, blue, white, yellow, purple, and matt, etc. Solder mask hardness: 6H Legend/Silkscreen Color: white, yellow, black, etc. Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc. Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc. Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micor metallographic section analysis, etc. Wrap and twist: ≤0.7% Flammability: 94V-0H8271978946