出生地 |
Jiangsu China (Mainland) |
Detailed Product DescriptionPCBproductionprocess(4layerPCBprocess) Laminationcuting--------Inlayer--------Pressing---------AOI----------Drilling---------Immersioncopper/copperplating----------Circuit---------Pressing-----------Sinkhole--------Laser---------Drilling--------Immersioncopper/copperplating--------Circuit---------AOI--------soldermask--------Silkscreen---------Immersiongold/Tinspraying--------Routing---------ElectricalTest/E-test-------PQC(FinalQualityControl)------Packing-------Sendgoods Our Factory Manufacture Capability: ItemManufacturingCapabilities1BaseMaterialFR-4,CEM-3,AL-based,Ceramic-based,PTFE2Min.FinishedHole0.2mm3Min.Track/Space4mil/3.5mil4CopperThickness0.5 5OZ5FinishedThickness0.3 4.0mm6Max.Layers267FinishedSurfaceHASL,OSP,ENIG,ImmersionSilver,ImmersionTin8CharacteristicImpedance28±3Ω,50±5Ω,60±6Ω,75±8Ω,100±10Ω 1.LeadfreeHASL 2.Certificate:UL,ROHS,T/S16949 3.Companymanagement:ISO9001:2000 4.Markets:Europe,America,Asia-LeadfreeHASLSurfacefinishrequiredtomeetROHScompliant-FR4materialwith0.2mm-3.2mmboardsthickness-Copperweight:0.5OZ,1OZ,2OZ,3OZ-4-4milstrackwidthspacing-0.2mmminfinishedholesize-Certificate:UL,ROHS,ISO14001/2004,ISO9001/2000,ISO/TS16949/2004,State-levelHi-techEnterprise,JiangsuProvincialHi-techEnterprise-Companymanagement:ISO9001:2000 -Markets:UnitedStates,Canada,Germany,Japan,TaiwanandHongKong