High Performance Heatsink Compound-SP1g HY550Serie

High Performance Heatsink Compound-SP1g HY500Series Feature Excellent Stability: HY550 thermal compound is engineered to not separate, run, migrate, or bleed.Electrical Insulator: HY550 It is a pure electrical insulator, neither electrically conductive nor capacitive.Performance: 2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.Application 1Electronicsparts,IC,CPU,MOS. 2LED,M/B,PS,Heatsink,LCD-TV,NB,PC,andsoon. 3DDRIIModule,DVDapplications,andsoon. Specification PropertyValueTest MethodAppearanceGrey Paste--Thermal Conductivity 1.974 W/m/K Hot Wire MethodPer Mil-C-47113Specific Gravity at 25°C2.5 g/ccASTM-D-70Volume Resistivity1.65 x 1014 ohm-cmASTM-D-257Operating Temperature Range-40 to 300 °C--Composition Siliconecompounds 50% 45% 25% 5% % CarbonCompounds 30% 35% 50% 65% % MetalOxideCompounds 20% 20% 25% 30% % package ST SP TU CN Other Category Content package Softtube Minipackage Syringe Can Other HY-500 grey purple 20g 25g 0.5g 1.5g 0.5g 30g 30g 1000g 0.5g 5g Important Reminder 1Use only as thermal grease. 2Keep out of the reach of children. 3Avoid contact with skin and eyes. If contacted, flush with water and get medical attention if irritation persists. 4Do not ingest or put into mouth. If injested, do not induce vomiting. Rinse mouth and seek medical attention www.halnziye.net Sincereserviceattitude,flexiblecooperationandsuperiorproductquality!