High Frequency Microwave substrate

ZYF260AA Type PTFE Fiberglas Nano-ceramic Fill substrate FeaturesTest MethodConditionsZYF250A Permittivity@10GHzIPC TM-650 2.5.5.5C23/502.6Permittivity@1MHzIPC TM-650 2.5.5.3C23/502.6Dielectric loss angle tangent@10GHzIPC TM-650 2.5.5.5C23/500.0017Dielectric loss angle tangent@1MHzIPC TM-650 2.5.5.3C23/500.00135Thermal conductivity (ppm/°C)IPC TM-650 2.5.5.5 Adapted-10°C to +140°CAfter Thermal Stress-80Peel Strength (lbs.per inch)IPC TM-650 2.4.817Volume resistivity (MΩ-cm)IPC TM-650 2.5.17.1C96/35/901.1 x 10 9Surface Resistance (MΩ)IPC TM-650 2.5.17.1C96/35/904.5 x 10 7Arc resistance (Second)ASTM D-495D48/50>180Tensile modulus(X,Y) (kpsi)ASTM D-638A, 23°C>700Tensile Strength(X,Y)(kpsi)ASTM D-882A, 23°C>20Compression modulus (kpsi)ASTM D-695A, 23°C>365Bending modulus (kpsi)ASTM D-790A, 23°C>540Dielectric Breakdown Voltage(kV)ASTM D-149D48/50> 45Density (g/cm3)ASTM D-792 Method AA, 23°C2.3Absorption (%)MIL-S-13949H 3.7.7E1/105 + D24/230.04IPC TM-650 2.6.2.2CTE(ppm/°C) XAxisIPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer0°C to 100°C16YAxis16ZAxis80Thermal conductivity of (W/mK)ASTM E-1225100°C0.32FlammabilityUL 94 Vertical Burn IPC TM-650 2.3.10C48/23/50, E24/125Meets requirements of UL94-V0