heat transfer thermal pad thermal conductive pad t
原价: 5,00 USD
Fiona Xiang
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基本信息
| 出生地 | Guangdong China (Mainland) |
|---|---|
| 牌子的名字 | AOK |
| 模式的数量 | UTP100 |
| 类型 | 绝缘纸 |
| 适用 | 高温 |
Heat transferThermal pad thermal pad/thermal gap filler/thermal conductive pad Applications: - Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink. - Led Lighting, LCD TV, Telecom device, Wireless Hub,Power supply etc - Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink Specification sheet Typical Properties of UTP100 PropertiesUnitsMetric ValueTest MethodConstruction & Composition----Silicone & Fiberglass----Color----pink & whiteVisualThickness Rangemm0.5 6.0----HardnessShore C10ASTM D2240Densityg/cc2.0ASTM D792Tensile StrengthKN/m2.5ASTM D412Elongation%60ASTM D412Continuous Use Temp-40 to 150EN344Breakdown VoltageKv/mm≥6.0ASTM D149Volume Impedanceohm-cm6.2*1015ASTM D257Dielectric Constant1MHz5.27ASTM D150Weight Daminify----≤1@150 240HFlame Rating----V-0UL 94Thermal ConductivityW/m.k1.0ASTM E1461UL, RoHS, REACH----Compliance----
交货条款及包装
Packaging Detail: Cartom Dimension:425x225x95mm Delivery Detail: 3-5days
端口: SZ
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