epoxy steel adhesive

epoxy steel adhesive

原价: 1,00 USD
中国
生产能力:
2000 吨 / 月
sarah chen
联系人姓名

基本信息

分类 其他的粘合剂
其他的名字 glue
出生地 Jiangsu China (Mainland)
使用 customer electronics
牌子的名字 youbai
模式的数量 A02
What is IMP IMP is the abbreviation of In-Mold Pasting innovative technology, which can replace the traditional bonding process. IMP is in use of nano adhesive to coat on the metal surface and put it with the injection mold to have bonding directly. Conception of IMP The adhesive gluing in the metal surface what area needs to bond with plastic, after 30 minutes of air drying to direct into the mold forming, the temperature generated by injection to have the combination of metal and plastic completely. Purpose of product features To achieve the process simpler, looks perfect, stronger bonding, and save costs. The nano adhesive is good for the use on bonding metal case and plastic of electronics, for example: laptop case, mobile phone, GPS, MP3, etc.. Applicable to metal and plastic For Metal 1.5052 Aluminum 2.304 Stainless steel For plastic 1 . PC+ABS 2 . PPS 3 . PBT 4 . PC Advantage 1. Reduce the thickness and weight of product 2. Enhance product strength 3. Internal space-saving (Interior space is not wasted) 4. Compared with the traditional technology, IMP can tolerate higher temperature and facilitate the surface treatment 5. More conducive to surface treatment. For example: anodizing, painting. 6. Simplify the working process, increase productivity 7. Cost reduction 8. Do not need to bury nails (can bury nails, ultrasound) 9. Independent design (independent RIB, BOSS) 10. Can be combined with multi-piece iron (One injection shot to complete three iron parts and plastic) Applications Mobile phone, MP3 Digital camera E-book Automotive parts Notebook GPS, and all have to use ultra-thin appearance of electronic products Sincerely look forward to receiving your letters or calls for any questions.

交货条款及包装

Packaging Detail: rubber barrel Delivery Detail: 20days
端口: shanghai port

付款条款

Letter of credit

Telegraphic transfer

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