低固定胶带

Low Static Polyimide Film Tape KD801/802 is a polyimide film-backed silicone adhesive tape with extremely low electrostiatic discharge properties. Product ConstructionKD801 KD802 Backing Polyimide Polyimide Adhesive Silicone Silicone Technical Data Product Units KD801 KD802 Test method Backing Thickness: mm 0.025 0.025Total Tape Thickness: mm 0.040 0.066Adhesion to Steel: N/cm 3.5 6 GB-T2972-98 Tensile Strength at Break: N/cm 58 58 GB-T7753-87 Elongation at Break: % 60 60 GB-T7753-87 Upmost use Temperature : ° C 280 280 Surface resistance: ohms >106 >106 Static Charge: Removal from roll: V <100 <100 Removal from SUS: V <50 <50 Dielectric Strength volts 8000 GB/T7752-87 Application Mask for printed circuit boards during wave solder or solder dip process Features Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal form SUS. Conventional polyimide tape typically generate over 10,000volts during use which can damage around electronic components . The low static properties of KD801/802 can eliminate circuit board degradation. Storage Details Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. shelf life is 6 months from the date of manufacture. Remark All technical data in this document are based upon our lab tests or experience. However, many factors are uniquely within the users knowledge and control, it is essential that the user evaluate the product to determine whether it is fit for a particular purpose and suitable for the users method of application.