Chip 1210 Series SMD PPTC

Chip 1210 Series SMD PPTC Features: Surface Mount Devices Lead free device Size 3225mm/1210 mils Surface Mount packaging for automated assembly Applications: Applications Almost anywhere there is a low voltage power supply, up to 30V and a load to be protected, including: Computer mother board, Modem. Telecommunication equipments. Performance Specification: 1210 MaximumResistanceModelMarkingVmaxImaxIholdItripPd Time To Trip@25°C@25°CTyp.CurrentTimeRiminRitypR1max(V)(A)(A)(A)(W)(A)(Sec)(W)(W)(W)SMD1210-005αA301000.050.150.60.251.502.80025.00050.000SMD1210-010αB301000.100.300.60.500.600.8005.00015.000SMD1210-020αC301000.200.400.68.00.020.4002.0005.000SMD1210-035αD61000.350.750.68.00.200.2001.300SMD1210-050αF13.21000.501.000.68.00.100.1800.4000.900SMD1210-075αG61000.751.500.68.00.100.0700.1300.400SMD1210-110αH61001.102.200.68.00.300.0500.1000.210SMD1210-150αL61001.503.000.68.00.500.0300.0700.110Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.