| 出生地 |
Jiangsu China (Mainland) |
| 牌子的名字 |
jitai |
| 材料 |
金属 |
Can-flat form Metal Package Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and marking on the surface.. Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating. Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.