Aluminum base copper clad laminate

Cerificates: UL approval (E 136069) ISO 2000 Product Type: HA42 Thermal conductivity≤ 1.0 2.0W/M.K Features: Excellent thermal conductivity Excellent dimensional stability Excellent mechanical properties Excellent electromagnetic shielding Main Property: Item Test ConditionUnitSpecTypical ValueThermal ImpedanceA/W≤2.0-Internal TO-220≤1.00.90Thermal ConducivityAW/M.K--ASTM 5470-D1.0-2.01.10Peel StrengthAN/mm≥1.401.84IPC-TM-650 2.4.81.73Surface ResistivityC96/35/90MΩ≥10410 6E-24/125≥10310 5IPC-TM-650 2.5.17.1Volume ResistivityC96/35/90MΩ-cm≥10610 7E-24/125≥10310 5IPC-TM-650 2.5.17.1Elecctrical StrdngthAKV/mm≥3045IPC-TM-650 2.5.6.2Dielectric ConstantIPC-TM-650 2.5.5.2--7Arc ResistanceD48/50+D0.5/23S≥60120IPC-TM-650 2.5.1FlammabilityUL94V-0V-0IPC-TM-650 2.3.10 TgDSC135±5135IPC-TM-650 2.4.25Water AbsorptionD-24/23%≤0.50.18IPC-TM-650 2.6.2.1CTIA-≥175200IEC-60112 Application: LED Lighting circuit Power supply Hybrid integrated circuits Solid State Relays Specification: Aluminum Substrate Thickness: 1.0mm 1.2mm 1.5mm 2.0mm Copper Foil: 18um 35um 70um 105um Standard Size: 500X600mm 500X1200mm 600X1200mm 1100X1200mm