24-36-60PCS高权力导致筹码

This product adopts chip integration technics to increase total output power so as to improveproduct brightness.This product adopts high integrated technics to flip directly the wafer to the heat sinks so as to make a smaller product dimension.This product adopts LED Array technology, which leads more even optical spots than LAMP.this product applies the splendid heat conduction system to remove wafer thermal resistance quickly, and to extend the product's life.This product adopts flipping encapsultion technology, and combined with high heat conduction metal aluminum baseplate in order to lower thermal.Specifications GLK-24GLK-36GLK-60CHIP SIZE16mil16mil16milELECTRO CHARACTERISTICSDC9V/450mADC9V/600mADC9V/1000mASIZEΦ20mmΦ20mmΦ20mmELECTRO POWER4W5.4W9WOPTICAL POWER1000mW1350mW2250mWELECTRO-OPTICAL CONVERSION RATE25%25%25%WAVELENGTH850nm850nm850nmOPERATING TEMPERATURE-20°C to +60°C-20°C to +60°C-20°C to +60°CMAX JUNCTION TEMPERATURE65°C65°C65°C