HQ-200 epoxy glue

TYPICAL CURED PROPERTINS Color Clean Coefficient of Thermal Expansion(CTE, ppm/°C) α1 75 α2 65 Glass Transition Temperature(Tg,°C) 55 Moisture Absorption < 1.0% Dielectric Constant at 60HZ 3.0 Dissipation Factor at 60HZ 0.01 Extracable Ion Content Chloride(Cl- ) < 10 ppm Potassium(K+) < 10 ppm Sodium(Na+ ) < 10 ppm CURING CONDITION Suggested cure schedules are general guidelines for typical properties of the HQ-120 under standard testing condition.Other cure schedules are possible and may yield better satisfactory results for each application. The curing time below does not include the oven temperature ramping up time. Additional temperature ramping up time should be counted in actual curing Cure Temperature (°C) Cure Time (Minute) 130 5 REWORK PROCEDURE Locally heat up the component above the solder reflow temperature. Take off the Component using a slight twisting motion. Clean the site by removing any excess Underfill liquid with a vacuum method. STORAGE & HANDLING l A storage temperature of below or equal to -5°C is recommended to maintain consistent viscosity, flow characteristics, and overall performance. l Allow the product to stabilize at room temperature for lat least one hour prior to use. l Read the Material Safety Data Sheet and warning label before using this product. l For assistance in preparing specifications, please contact APS office for details.