DIP PCBA

PCB Assembly products field: Industrial controlAlarm productsMeasurement deviceTelecom audio and videoConsumer electronics The Operations we handle:1. Bare Board Fabrication2. Full Component Procurement3. SMT/BGA/DIP Assembly4. Inspection/Function Test of Finished Goods5.Shipment Arrangement PCB Assembly Competence:1. Stencil size/range: 736*736mm 2.Minimum IC pitch:0.30mm3. Maximum PCB size: 410*360mm4. Minimum PCB thickness:0.35mm5. Minimum chip size:02016. Maximum BGA size:74*74mm7. BGA ball pitch: 1.00mm(min), 3.00mm(max)8. BGA ball diameter:0.4mm(min), 1.0mm(max)9. QFP lead pitch: 0.38mm(min), 2.54mm(max)10.Frequency of stencil cleaning: 1 time/5 to 10 pieces PCBA Equipment:1. JUKI 2050, JUKI 2020, JUKI760 and JUKI 7502---3 automated manufacturing SMT lines2. 1 Wave Soldering Line(supporting Rohs products)3. 2 Hand Manual Soldering Lines for DIP(supporting Rohs products)4.3 Semi-automaticPrinters(FSP-2015P, SP-3040A) Requested Infomation for Assembly:1. Gerber files or Protell 99 of the bare PC board, Bill of Material for assembly;2. Testing guide;3. To short the leadtime, pls kindly advise us if there is any acceptable components substitution.