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Our PCB got UL,SGS,ISO9001,RoHS,QS9000 and TS16949 certificates,and are used to a wide range of fields such as computers,digital products,medical equipment,automobiles,communication devices, military,industrial control and aviation. PCB process capability layer:2-22 layer product type:Rigid PCB,HDI PCB,thick copper PCB Materials:FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg Copper Thickness:140micron(4oz) Min Board Thickness:0.4mm Max Board Thickness:5.0mm Min finished Hole Diameter:0.1mm Outer layer line width / spacing:0.1mm/0.1mm Inner layer line width / spacing:0.1mm/0.1mm Min aperture: 0.2mm Min Laser drilling:0.1mm Min Ring Width:0.11mm Min BGA-bit hole spacing:0.4mm Resistance Tolerance:±10% Minimum Insulation Thickness:3mil Maximum laser blind hole thickness to diameter ratio:0.8:1 Maximum working board size:520*622mm Drilling Tolerance (PTH):±0.075mm Drilling tolerance (NPTH): ±0.05mm Outline Tolerance (CNC): ±0.13mm Surface:Lead Free HASL, HASL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing PCB production capacity Double sided PCB :200000 ft2 /Month Multilayer PCB :320000 ft2/Month HDI PCB : 80000 ft2/Month All of the above description is to demonstrate the ability of our PCB factory, if you have specific requirements, please feel freeto contact us.