ТАК модулей памяти Разъем, DDR Разъем

DDRCONNECTOR 200PIN SMT CONTACTS: Housnig Material: LCP UL94V-0 ROHS Contact Material: Phosphor Bronze Solder Materia: SPCC Contact Plated: Gold Plating in the contact area, And Tin Plating in the solder tail area,With 50u min Nickel under plating over all. Solder Plated: Sn plated Current Rating: 0.5Amp Contact Resistance: 55m ohms. Insulator Resistance: 500Megohms at 500V DC Min. Dielectric Withstanding: AC 300V for 1 minute Operating Temp.: -40°C +80°C Max Processing Temp.:230°C for 30 60 seconds 260°C for 10 seconds Insertion force: 2.5Kgf Max Withdrawal force: 2.5Kgf Max Durability: Insert&Withdraw 500 cycles.