освещение печатных плат PCBA сборки-

PCB&PCBA assembly, mould and plastic injection, cable instal and final profucts as one unit. We have advanced equipment for through-hole and SMT DIP COB cable assembly. . RoHS compliant and lead-free process. In-circuit, functional tests& burn-in tests, full system test 6. High output to guarantee prompt delivery. OurPCBcapability: Materialused:FR4,HighTgMinimum170C,Hifrequency,Metalbased:Aluminiumect. MaximumPanelSize:26"X26"(660mmX660mm) LineWidth&Spacing: MinimumLineWidth(Internal)4mil(0.1mm)formassproductionand3milforsamples MinimumLineWidth(External):4mil(0.1mm)formassproductionand3milsforsamples. MinimumLineSpacing(External):4mil(0.1mm)formassproductionand3milsforsamples. LayerCount&Thickness:2-12layers MinimumThickness(2Layers):4mil(0.1mm) MinimumThickness(4Layers):12mil(0.3mm) MinimumThickness(6Layers):16mil(0.4mm) MinimumThickness(8Layers):24mil(0.6mm) MaximumThickness(10layers):200mil(5.0mm) LayertoLayerRegistration:+/-5mil(0.13mm) Via/DrillSize:MinimumDrillHoleDiameter10mil(0.25mm) MinimumViaSize:8mil(0.2mm) HoletoHoleTolerance:+/-3mil(0.08mm) HoletoEdgeTolerance:+/-5mil(0.13mm) MicroVia:4mil(0.1mm) SolderMask:SolderMaskBridgeBetweenSolderDam3mil(0.07mm) Warpage:0.5% Impedance:+/-10% SurfaceFinish:HardGold/ENIG/HASL/CarbonInk/OSP(ENTEKCU106AX)/ImmersionTin Min.SMTPtich:12mil(0.2mm) Min.partsfootpins:0201 Productsinvolvedfields:consumeElectronics,Medicalequipments,Industrialcommands,communications,autopartsect.