Novalac эпоксидная смола

,Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy reisin, a large amount of tight cross-bonds are formed after being cured, resulting in excellent thermal stability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits. Specifications Brand CYDCN-200 Epoxy equivalent (g/eq), 195 210 Hydrolysable chlorine wt% ≤, 0.015 Inorgano-chlorine wt% ≤, 0.0005 Softening point, 60 75 Melting viscosity (mPa•s 150°C), 340 480 Volatile wt%≤, 0.15 Color (Gardner) ≤, 2 Application,encapsulant,electronic printing ink, laminates