LED тепловой PAD

LED Thermal PAD of P100 series materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. Features: 1.Good thermal conductive:1.5 5.0W/mK 2.Naturally tacky needing no further adhesive coating 3.Soft and Compressible for low stress applications 4.Available in varies thickness Applications: 1.Cooling components to the chassis of frame 2.High speed mass storage drives 3.RDRAM memory modules 4.Micro heat pipe thermal solutions 5.Automotive engine control units 6.Telecommunication hardware 7.Handheld portable electronics 8.Semiconductor automated test equipment (ATE) 9.LED (Down lamp, Spot light, Streetlamp), LED Server Power Typical Properties of P100 seriesColorGrayVisualConstruction & CompostionCeramic filled silicone elastomer***Specific Gravity2.1 g/ccASTM D297Heat Capacity1 l/g-KASTM C351Hardness60 Shore 00ASTM 2240Tensile Strength60 psiASTM D412Continuous Use Temp-50 to 200°C***Dielectric Breakdown Voltage>1500 >5500 VACASTM D149Dielectric Constant5.5 MHzASTM D150Volume Resistivity4.0X10" Ohm-meterASTM D257Flame Rating94 V0E196995Thermal Conductivity1.5 5.0 W/m-KASTM D5470