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10L HDI PCB,FR4 1.6mm,2oz Cu,Imm gold. 1)The base Material: FR-4 / Flexible board, Other material: FR-5/ Tg170/ Polyclad / Rogers / Teflon/ Aluminium Base material 2)Max Copper Thickness: 6OZ (210um) 3)Finished Board Thickness : 0.15mm 7.5mm 4)Layers : 2 Layers 50 Layers 5)Max Production Panel Size (L*W): 1092 mmX 762 mm (43X30 sq inch) 6)Minimum Internal Layer Line/space : 3mils/3mils 7)Minimum Laser Blind Via Hole size : 0.10mm (4mils) 8)Max Aspect Ratios: 15:1 (hole size:0.25mm) 9)Min.Solder Mask Bridge: 0.050mm(2mils) 10)SMT Pitch: 0.25mm (10mils) 11)Impendance Control: +/- 5% 12)Surface Processing: HAL,Lead-free-Hal,Flash Gold ,Thick Gold, Immersion Gold/Silver/Tin, Gold Finger plating, Pre-flux(Entek),OSP, Seletive ENIG 13)Solder Mask Types : Liquid Photo-Imageable(W/F), Conventional S/M, UV S/M 14)Profile : CNC Routing,Punching,V-Cut 15)Special-Tech: Blind and buried via \ Backplane \ HDI: 1+N+1,2+N+2 \Impendance control, Back Drilling\ Bury Resistor \ Bury Capacitor \ Mix Pressing \ Step Slot&Step Boards