BTB шаг 0,4 мм разъем 1.50mm паре высотой

raw materials: copper alloy and plastic components use:Cellular phones,DVI,Digital cameras Pinnumbers:24Pin,54Pin,60 Pin FEATURES: 1. 0.4 mm pitch and support for mated heights of up to 1.5mm,2.0 mm, 2.5mm, 3.0 mm, 3.5 mm, and 4.0 mm 2.It is constructed with impact dispersion keys inside the body to disperse shocks when dropped. 3.Construction makes designing devices easier. The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. This enables freedom in pattern wiring, helping to make PCB’s smaller. 4.Design makes efficient mounting. Features a terminal flatness of 0.08 mm, construction resistant to creeping flux, and design that facilitates visual inspection of the soldered part. ItemSpecifications Conditions Electrical Characteristics Rated current 0.3A/contact (Max. 5 A at total contacts) Rated voltage 60V AC/DC Breakdown voltage 150V AC for 1 min. Detection current: 1mA Insulation resistance Min. 1,000mΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 70mΩ Based on the contact resistance measurement methodspecified by JIS C 5402. MechanicalcharacteristicsComposite insertion force Max. 0.981N {100gf}/contacts × contacts (initial) Composite removal force Min. 0.0588N {6gf}/contacts contacts(Mated height 1.5 mm, without removal and soldering terminal) Min. 0.118N {12gf}/contacts × contacts (Mated height 1.5 mm, except without removal and soldering terminal) Post holding force Min. 0.981N {100gf}/contacts Measuring the maximum force.As the contact is axially pull out. Environmentalcharacteristics Ambient temperature –55°C to +85°C No freezing at low temperatures Soldering heat resistance Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals)Infrared reflow soldering 300°C within 5 sec. 350°C within 3 sec.Soldering ironStorage temperature –55°C to +85°C (product only)–40°C to +50°C (emboss packing) No freezing at low temperatures.No dew condensation. Thermal shock resistance(header and socket mated 5 cycles,insulation resistance min. 100mΩ,contact resistance max. 70mΩ Sequence1. –55 °C, 30 minutes2. , Max. 5 minutes3. 85 °C, 30 minutes4. , Max. 5 minutes Humidity resistance(header and socket mated) 120 hours,insulation resistance min. 100mΩ,contact resistance max. 70mΩ Bath temperature 40±2°C,humidity 90 to 95% R.H. Saltwater spray resistance(header and socket mated) 24 hours,insulation resistance min. 100mΩ,contact resistance max. 70mΩ Bath temperature 35±2°C,saltwater concentration 5±1% H2S resistance(header and socket mated) 48 hours,contact resistance max. 70mΩ Bath temperature 40±2°C,gas concentration 3±1 ppm,humidity 75 to 80% R.H.