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Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives.Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint.Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time.The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste.With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test yields. P-YT20031 P-YT20032 P-YT20033 P-YT20051 Alloy CompositionSn3.0Ag0.5CuRE Sn0.3Ag0.7CuRE Sn1.0Ag0.5CuRE Sn58Bi Powder SizeTypeIII 25 45umTypeIII 25 -45umType III 25 45umType III25 45um TypeIV 20-38um TypeIV 20-38um TypeIV 20-38um TypeIV 20-38um SIR(Ω) ≥1x1012 ≥1x1012 ≥1x1012 ≥1x1012 Corrosion of Residue No corrosion No corrosion No corrosion No corrosion We also have other types solder paste products with different alloy components from the above table.please contact us for the detail