sd card pcb

ItemMass Production CapacityPilot Run Production CapacityLayer Counts2--1618--20MaterialFR-4, High TG FR-4,PTFEAluminum Base,Rogers,etcNelco, ectMaterial Mixed Laminate4 layers -- 8 layers10 layers --14 layersMaximum Size610mm X 1100mmBoard Outline Tolerance±0.13mm±0.10mmBoard Thickness0.40mm—4.0mm0.35mm—6.0mmThickness Tolerance( thighter than 0.8mm)±8%±5%Thickness Tolerance( t lower than0.8mm)±10%±8%Insulation Layer Thickness0.10mm—4.00mm0.075mm--0.100mmMinimum Line0.10mm0.075mmMinimum Space0.10mm0.075mmOut Layer Copper Thickness35um--175um35um--210umInner Layer Copper Thickness17um--175um17um--210umDrilling Hole (Mechanical)0.25mm--6.35mm0.15mm--0.25mmFinish Hole (Mechanical)0.20mm--6.30mm0.10mm--0.20mmDiameter Tolerance (Mechanical)0.05mmRegistration (Mechanical)0.075mm0.050mmLaser Hole0.10mm0.075mmAspect Ratio10:112:1;16:1Solder Mask TypeLPISMT Mini. Solder Mask Width0.10mm0.075mmMini. Solder Mask Clearance0.05mm0.025mmPlug Hole Diameter0.25mm--0.60mm0.70mm--1.00mmImpedance Control Tolerance±10%±5%Surface FinishHASL, Immersion Gold,OSP, Immersion TinPlating Gold, etc Comment: Pilot Run Production means only medium order or small order for that kind production.