Mobile Phone PCBA

circuit board layout smt bga pcb assembly Surface Mount Technology (SMT) Through Hole Circuit Boards (PTH) Mixed Technology PCB Functional Testing Automated Optical Inspection - Inline Box Build; Full Assemblies Design for Manufacturability (DFM) Full Project Management Engineering Design IPC CLASS II and CLASS III certified BGAs and CCGAs Micro and Fine Pitch BGAs SMT 24" x 30"for press fit Backplanes CGA's to 1.0mm PBGA's, uBGA's CSP,s to 0.5mm leaded parts to 0.3 mm chips and discretes to 0402 chips and discretes to 0201 (pending-please inquire) Automatic wave solder 18" max board width x __ length Selective soldering capabilities - no board size limitation Full autopress capability for high density press fit connectors (VHDM R and Zpack R)