Leiterplatte mit 4 Schichten Leiterplatten

Strong sourcing ability in relative parts and components - Active and passive components source is directly from original manufacturer - High-precision 0201 size components SMT technology and lead-free - RoHS compliant SMT and wave solder process - Experienced technical staffs in charge of product design - Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly - IC pre-program - Full experienced QC and inspector - Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly - High-precision E-Testing include: ICT, BGA repair device, function test -Factory:5000jobs/Month -SMT: 7,000,000 Points/Day -Auto DIP:3,500,000 Points/Day