Flexible Leiterplatte

Standard flexible pcb flexible printed circuitfpc Key Capabilities: Single or double-sided circuitry/multilayer flexible circuit Adhesive-based construction ` PET, PEN or PI film substrates Low-cost, roll-to-roll manufacture Screen print imaging with minimum conductor pitch at 0.50mm Photo imaging with minimum conductor pitch at 0.25mm Screened ink, photo imageable, or laminated cover film surface dielectrics Surface finishes from anti-tarnish to immersion silver to tin to nickel/gold Circuitry can be supplied in continuous roll format Nova FPC HDI Key Capabilities: Highest density flexible circuit Excellent in harsh chemical or thermal environments ` Available with 25 micron microvias and conductor pitch at 150 microns Proven effective in dynamic flex applications Often selected for controlled impedance circuitry Excellent material for wire bond applications f